In today’s data centres, there is a driver from equipment manufacturers to increase inlet temperatures (up to 27°C) and there is increasing demand for higher power consumptions and high-density solutions. This has resulted in elevated equipment exhaust temperatures which in turn, compromises the reliability and rating of the power strip, by impacting the surrounding ambient temperature where the power strip is positioned.
Certain components, such as LCD screens, neon indicators and internal power supplies are vulnerable in such high ambient temperatures with resulting reductions in life expectancy and reliability.
With these design considerations in mind, MPL Technology Group has designed its family of PDUs to offer the highest levels of resilience, by developing an architecture which reduces points of failure and enhances overall reliability by reducing power strip complexity.